COPPER ALLOY MATERIAL AS WELL AS RESISTIVE MATERIAL FOR RESISTOR USING THE SAME AND RESISTOR

To provide a copper alloy material that is large in a ratio of a shear surface occupying on a press-punched surface generated at the time of press-punching, has sufficiently high volume resistivity, has a resistance temperature coefficient (TCR) that is negative and small in the absolute value, and has a small absolute value of copper thermoelectromotive force (EMF) as well as a resistive material for resistors therewith and a resistor.SOLUTION: A copper alloy material contains Mn: 20.0 mass% or more and 35.0 mass% or less, and Ni: 6.5 mass% or more and 17.0 mass% or less, and the remaining portion is a copper alloy material having an alloy composition composed of Cu and unavoidable impurities. In a longitudinal section containing a drawing direction and a thickness direction of the copper alloy, when a crystal orientation distribution function (ODF) obtained from crystal orientation analysis due to a SEM-EBSD method is expressed by Euler angle (Φ1, Φ, Φ2), Φ1=0-90°, Φ=0-90°, and Φ2 is 15°-20°and a maximum value of orientation density at 25°exceeds 6.0.SELECTED DRAWING: Figure 1 【課題】プレス打ち抜き加工時に生じる打ち抜き加工面に占める剪断面の割合が大きく、十分に高い体積抵抗率を有し、抵抗温度係数（ＴＣＲ）が負であって絶対値が小さく、かつ対銅熱起電力（ＥＭＦ）の絶対値が小さい銅合金材ならびにそれを用いた抵抗器用抵抗材料および抵抗器を提供する。【解決手段】銅合金材は、Ｍｎ：２０．０質量％以上３５．０質量％以下、およびＮｉ：６．５質量％以上１７．０質量％以下を含有し、残部がＣｕおよび不可避不純物からなる合金組成を有する銅合金材であって、前記銅合金材の延伸方向と厚さ方向を含む縦断面にて、ＳＥＭ－ＥＢＳＤ法による結晶方位解析から得られる結晶方位分布関数（ＯＤＦ）を、オイラー角（φ１、Φ、φ２）で表したとき、φ１＝０～９０°、Φ＝０～９０°ならびにφ２が１５°、２０°および２５°における方位密度の最大値が、６．０を超える。【選択図】図１