EPOXY RESIN, RESIN COMPOSITION THEREOF, CURED PRODUCT THEREOF AND METHOD FOR PRODUCING EPOXY RESIN

To provide an epoxy resin composition which exhibits excellent low dielectric properties, an epoxy resin for providing the same and a method for producing the same.SOLUTION: There is provided an epoxy resin which comprises an epoxy resin component (A) represented by formula (1) and an epoxy resin co...

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Hauptverfasser: SO MASAHIRO, LEE GAYOUNG, YOUN HAERRY, KANEMITSU SHINGO, RYU KI HWAN, JEE JOONG HWI
Format: Patent
Sprache:eng ; jpn
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Zusammenfassung:To provide an epoxy resin composition which exhibits excellent low dielectric properties, an epoxy resin for providing the same and a method for producing the same.SOLUTION: There is provided an epoxy resin which comprises an epoxy resin component (A) represented by formula (1) and an epoxy resin component (B) represented by formula (5), wherein the component (B) ranges from 10 to 80 area% by GPC measurement. In the formulae, X represents a substituted phenylene group or the like, Z represents a glycidyl group or the like, n represents the number of repetitions, G represents a glycidyl group, R6 represents a hydrocarbon group or the like, s1 is 1 or 2, s2 represents an integer of 1 to 5 and s1+s2 represents an integer of 2 to 6.SELECTED DRAWING: Figure 1 【課題】優れた低誘電特性を発現するエポキシ樹脂組成物、それを与えるエポキシ樹脂、及びその製造方法。【解決手段】式(1)で表されるエポキシ樹脂成分(A)と式(5)で表されるエポキシ樹脂成分(B)を含み、GPC測定で、前記成分(B)が10~80面積%の範囲であるエポキシ樹脂。TIFF2024087617000053.tif36147TIFF2024087617000054.tif24149式中、Xは置換フェニレン基など、Zはグリシジル基など、nは繰り返し数を示す。Gはグリシジル基、R6は炭化水素基など、s1は1又は2、s2は1~5の整数、s1+s2は2~6の整数を示す。【選択図】図1