LAMINATE, LAMINATE MANUFACTURING METHOD, RESIN FILM MANUFACTURING METHOD, PLASTIC MOLDED PRODUCT, DISPLAY, SENSOR, AND MATERIAL FOR MANUFACTURING STEP

To provide a laminate with excellent transportability and being flexible.SOLUTION: There is provided a laminate having a resin layer on at least one surface of a supporting substrate, the laminate being characterized in that it satisfies all of the following conditions 1 to 5. Condition 1: 5% strain...

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Bibliographische Detailangaben
Hauptverfasser: YAHIRO KENSUKE, ISHIDA YASUYUKI, MIWA NORIFUMI
Format: Patent
Sprache:eng ; jpn
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Zusammenfassung:To provide a laminate with excellent transportability and being flexible.SOLUTION: There is provided a laminate having a resin layer on at least one surface of a supporting substrate, the laminate being characterized in that it satisfies all of the following conditions 1 to 5. Condition 1: 5% strain stress SF of a resin layer is 10 MPa or less. Condition 2: 5% strain stress SL of the laminate is 20 MPa or more. Condition 3: a peel strength Rb between the supporting substrate and the resin layer is 1,000 mN/50 mm or less. Condition 4: A thermal shrinkage rate of the laminate in a longitudinal direction at 150°C is 2.0% or less. Condition 5: A haze of the laminate is 15% or less.SELECTED DRAWING: Figure 1 【課題】本発明は、柔軟でありながら、搬送性に優れた積層体に関する。【解決手段】支持基材の少なくとも一方の面に、樹脂層を有する積層体であって、以下の条件1から条件5のすべてを満たすことを特徴とする、積層体。条件1: 樹脂層の5%歪み応力SFが10MPa以下。条件2: 積層体の5%歪み応力SLが20MPa以上。条件3: 支持基材と樹脂層の間の剥離力Rbが1,000mN/50mm以下。条件4: 積層体の150℃における長手方向熱収縮率が2.0%以下。条件5: 積層体のヘイズが15%以下。【選択図】図1