SUBSTRATE ASSEMBLING DEVICE

To provide a substrate assembling device in which an attachment error generated from a size error of an upper substrate and a lower substrate is removed and the upper substrate and the lower substrate can be attached accurately.SOLUTION: A substrate assembling device 1 includes a moving mechanism 41, an imaging device 10, and a controller 100. The controller 100 changes the displacement amount of a lower motion for each adhesive pin plate 8a and reduces the displacement between an upper substrate K1 and a lower substrate K2. A rough adjustment mark and a fine adjustment mark of one of the upper mark and the lower mark are black squares and a rough adjustment mark and a fine adjustment mark of the other of the upper mark and the lower mark are square frames. The square frames are of a size in a defined range which allows for the displacement of the black squares.SELECTED DRAWING: Figure 9 【課題】上基板と下基板の寸法誤差によって生じる貼り合せ誤差を解消して、上基板と下基板を精度よく貼り合せ可能な基板組立装置を提供することを課題とする。【解決手段】基板組立装置１は、移動機構４１と、撮像装置１０と、制御装置１００とを備えて成る。制御装置１００は、粘着ピンプレート８ａごとに下動の変位量を変えて上基板Ｋ１と下基板Ｋ２のずれを低減させる。上マークと下マークの一方のマークの粗調整用マークと微調整用マークは黒四角形状とし、他方のマークの粗調整用マークと微調整用マークは四角枠形状で、四角枠形状は黒四角形状のずれを許容する規定範囲のサイズとする。【選択図】図９