RESIN COMPOSITION

To provide a novel resin composition that yields a cured product with excellent adhesion to a conductor layer when exposed to high-temperature and high-humidity conditions, even in the case of employing compositions that contribute to excellent dielectric properties.SOLUTION: The present invention p...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	OISHI RYOHEI, NISHIMURA YOSHIO
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP
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