RESIN COMPOSITION

To provide a novel resin composition that yields a cured product with excellent adhesion to a conductor layer when exposed to high-temperature and high-humidity conditions, even in the case of employing compositions that contribute to excellent dielectric properties.SOLUTION: The present invention provides a resin composition comprising an epoxy resin represented by formula (1) and an active ester resin. (In formula (1), R1 independently represents a monovalent aliphatic group, L independently represents a single bond or a divalent linking group, RS independently represents a substituent, m independently represents an integer from 0 to 3, and n represents an integer from 0 to 5).SELECTED DRAWING: None 【課題】良好な誘電特性に寄与する組成を採用する場合であっても、高温高湿環境に曝露した際に良好な導体層との密着性を呈する硬化物をもたらすことができる、新規の樹脂組成物を提供する。【解決手段】下記式（１）で表されるエポキシ樹脂、及び、活性エステル樹脂を含む、樹脂組成物。TIFF2024085315000011.tif32170（式（１）中、Ｒ１は、それぞれ独立に、１価の脂肪族基を表し、Ｌは、それぞれ独立に、単結合、又は、２価の連結基を表し、ＲＳは、それぞれ独立に、置換基を表し、ｍは、それぞれ独立に、０～３の整数を表し、ｎは、０～５の整数を表す。）【選択図】なし