WAFER GRINDING APPARATUS

To provide a wafer grinding apparatus capable of evaluating sharpness of a grindstone in a construction of performing vibration of a grindstone part by an ultrasonic wave.SOLUTION: A wafer grinding apparatus 1 comprises: a workpiece holding part 2 that holds a workpiece W; a grindstone wheel 3 that includes a grindstone part 32; a grindstone wheel driving device 34 that performs grinding processing of a front surface of the workpiece W by the grindstone part 32 by axially rotating the grindstone wheel 3; an ultrasonic wave vibration device 4 that vibrates the grindstone part 32 in an axial direction by applying an ultrasonic wave to the grindstone part 32 during the grinding processing, to progress an autogenous blade of the grindstone part 32, thereby improving the sharpness of the grindstone part 32; a grindstone information acquisition part 511 that acquires information in regard to the grindstone wheel 3; and a grindstone state evaluation part 513 that evaluates a grindstone state including the sharpness of at least the grindstone part 32 on the basis of the information acquired by the grindstone information acquisition part 511.SELECTED DRAWING: Figure 2 【課題】超音波による砥石部の加振を行う構成において、砥石の切れ味を評価することができるウエハ研削装置を提供する。【解決手段】ウエハ研削装置１はワークＷを保持するワーク保持部２と、砥石部３２を有する砥石ホイール３と、砥石ホイール３を軸回転して砥石部３２によりワークＷの表面を研削加工する砥石ホイール駆動装置３４と、研削加工中に砥石部３２に超音波を付与して軸方向に砥石部３２を加振して砥石部３２の自生発刃を促進して砥石部３２の切れ味を向上させる超音波加振装置４と、砥石ホイール３に関する情報を取得する砥石情報取得部５１１と、砥石情報取得部５１１により取得された上記情報に基づいて少なくとも砥石部３２の切れ味を含む砥石状態を評価する砥石状態評価部５１３とを備える。【選択図】図２