INSPECTION DEVICE AND METHOD FOR INSPECTION

To provide an inspection device and a method for an inspection which can accurately and rapidly inspect a wafer for the appearance.SOLUTION: An inspection device (1) includes: a three-dimensional shape measuring machine (52) for measuring a three-dimensional shape of an inspection target object on a wafer; and a calculation unit (10) for calculating a measurement cost required to measure the inspection target object on the wafer on the basis of inspection target object arrangement information regarding the arrangement of the inspection target object and the size of the measurement vision of the three-dimensional shape measuring machine.SELECTED DRAWING: Figure 1 【課題】 ウェーハの外観検査を正確かつ高速に行うことが可能な検査装置及び検査方法を提供する。【解決手段】 検査装置（１）は、ウェーハ上の検査対象物の３次元形状を測定する３次元形状測定機（５２）と、検査対象物の配置に関する検査対象物配置情報と、３次元形状測定機の測定視野のサイズに基づいて、ウェーハ上の検査対象物の測定に要する測定コストを計算する計算部（１０）とを備える。【選択図】 図１