CONDUCTIVE COMPOSITION AND CONDUCTIVE FILM FORMATION METHOD

To provide a conductive composition and a conductive film formation method which form a conductive film having a high electromagnetic shield effect at low cost.SOLUTION: A conductive composition exhibits conductivity after baking. The conductive composition contains copper nanoparticles, a liquid di...

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Bibliographische Detailangaben
Hauptverfasser:	HAMANO TSUBASA, KAJIYAMA SHIN, MITA MICHIHIRO
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	To provide a conductive composition and a conductive film formation method which form a conductive film having a high electromagnetic shield effect at low cost.SOLUTION: A conductive composition exhibits conductivity after baking. The conductive composition contains copper nanoparticles, a liquid dispersion medium, a dispersion agent, and a thermosetting organic matrix. The dispersion agent disperses the copper nanoparticles in the dispersion medium. The dispersion agent is a polymer compound containing a nitrogen atom or a phosphorus atom. The organic matrix is composed of a liquid epoxy resin and a curing agent for curing the epoxy resin. The curing agent is a basic nitrogen-containing compound. A conductive film formation method performs baking under a formic acid atmosphere or immersion in a formic acid aqueous solution before baking.SELECTED DRAWING: Figure 1 【課題】電磁シールド効果が高い導電膜を低コストに形成するための導電性組成物及び導電膜形成方法を提供する。【解決手段】導電性組成物は、焼成後に導電性を発現する。導電性組成物は、銅ナノ粒子と、液体の分散媒と、分散剤と、熱硬化性の有機マトリックスとを含有する。分散剤は、銅ナノ粒子を分散媒中で分散させるものである。分散剤は、窒素原子又はリン原子を含む高分子化合物である。有機マトリックスは、液状のエポキシ樹脂及びそのエポキシ樹脂を硬化させる硬化剤から成る。その硬化剤は、塩基性含窒素化合物である。この導電膜形成方法において、ギ酸雰囲気下での焼成、又は焼成前のギ酸水溶液への浸漬が行われる。【選択図】図１