ELECTRONIC MODULE

To provide an electronic module which can effectively heat an electronic component.SOLUTION: An electronic module according to an embodiment of the present invention includes a substrate, a heating target component, and a heater unit. The heating target component is provided on one surface of the substrate. The heater units are disposed at positions different from each other in a lamination direction in which the substrate and the heating target component are laminated with each other, in a surface direction of the substrate, or in combination of the lamination direction and the surface direction. The heater units have a plurality of temperature adjusting units with different heating amounts or heat exchange amounts to heat the heating target component.SELECTED DRAWING: Figure 1 【課題】電子部品を効果的に加熱できる電子モジュールを提供する。【解決手段】実施形態にかかる電子モジュールは、基板と、加熱対象部品と、ヒータユニットと、を備える。加熱対象部品は、前記基板の一方の面に設けられる。ヒータユニットは前記基板と加熱対象部品とが積層される積層方向、前記基板の面方向、または前記積層方向および前記面方向の組み合わせにおいて、互いに異なる位置に配されるとともに、加熱量または熱交換量が異なる複数の温調部を有し、前記加熱対象部品を加熱する。【選択図】 図１