MICRO-LAYER CMP POLISHING SUBPAD

To provide a chemical mechanical polishing subpad having micropores.SOLUTION: A polishing pad 10 has: a polymeric matrix; a polishing surface 14 useful for polishing at least one of semiconductor, magnetic and optical substrates; a bottom surface 16; and a porous subpad adhering to the bottom surfac...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	ANNETTE CREVASSE, HOU GUANHUA, WANG TECHUN, NESTOR A VASQUEZ, BRYAN BARTON, ANDREW WANK, JOHN R MCCORMICK, ALAAEDDIN ALSBAIEE
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TRANSPORTING
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