PACKAGE, SEMICONDUCTOR DEVICE, AND DEVICE

To provide a technique for suppressing the reduction in the visibility of a mark for identification.SOLUTION: A package includes on one of the faces of a base a plurality of terminals and a mark portion provided with a mark for identification. A smooth portion is provided between at least one of the...

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Bibliographische Detailangaben
Hauptverfasser:	KIMURA SHOTO, MINAMI YOSHIHIRO, NOZU KAZUYA
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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Beschreibung
Zusammenfassung:	To provide a technique for suppressing the reduction in the visibility of a mark for identification.SOLUTION: A package includes on one of the faces of a base a plurality of terminals and a mark portion provided with a mark for identification. A smooth portion is provided between at least one of the plurality of terminals and the mark portion, which is smoother than the other portion between the plurality of terminals and the mark portion.SELECTED DRAWING: Figure 1 【課題】識別用のマークの視認性の低下を抑制する技術を提供する。【解決手段】基台の１つの面に、複数の端子と識別用のマークが設けられたマーク部とを備えるパッケージであって、前記面のうち前記複数の端子のうち少なくとも１つの端子と前記マーク部との間に、前記複数の端子と前記マーク部との間の他の部分よりも滑らかな平滑部が設けられている。【選択図】図１