WORKPIECE GRINDING METHOD

To provide a workpiece grinding method which can suppress warpage of workpiece after grinding.SOLUTION: A workpiece grinding method includes a bonding step 101 of bonding a protective sheet onto a surface side of workpiece, a groove formation step 102 of forming a groove in the protective sheet in a...

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Bibliographische Detailangaben
Hauptverfasser: MIGIYAMA YOSHIKUNI, ODA ATSUSHI, KAJIURA KAZUTERU
Format: Patent
Sprache:eng ; jpn
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Beschreibung
Zusammenfassung:To provide a workpiece grinding method which can suppress warpage of workpiece after grinding.SOLUTION: A workpiece grinding method includes a bonding step 101 of bonding a protective sheet onto a surface side of workpiece, a groove formation step 102 of forming a groove in the protective sheet in a state in which a rear face opposite to the surface of the workpiece is held by a first chuck table, and a grinding step 103 of holding the protective sheet side of the workpiece by a second chuck table, grinding the rear face of the workpiece and grinding the workpiece to a finish thickness, wherein the groove formation step 102 forms a groove in a direction crossing a warp direction generated in the workpiece after the polishing by internal stress of the protective sheet, and releases the internal stress.SELECTED DRAWING: Figure 2 【課題】研削後に被加工物が反ることを抑制することができる被加工物の研削方法を提供すること。【解決手段】被加工物の研削方法は、被加工物の表面側に保護シートを貼着する貼着ステップ101と、被加工物の表面と反対の裏面を第1チャックテーブルで保持した状態で保護シートに溝を形成する溝形成ステップ102と、被加工物の保護シート側を第2チャックテーブルで保持し、被加工物の裏面を研削し被加工物を仕上げ厚さに研削する研削ステップ103と、を備え、溝形成ステップ102は、保護シートの内部応力によって研削後の被加工物に発生する反り方向と交差する方向に溝を形成し、内部応力を開放する。【選択図】図2