CLEANING METHOD OF PROCESSING CHAMBER AND SUBSTRATE PROCESSING SYSTEM
To provide a technique capable of effectively cleaning the inside of a supercritical processing chamber that has a processing space with the narrow opening and deep depth.SOLUTION: There is provided a cleaning method of a processing chamber in a supercritical processing device in which a support par...
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| Format: | Patent |
| Sprache: | eng ; jpn |
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| Zusammenfassung: | To provide a technique capable of effectively cleaning the inside of a supercritical processing chamber that has a processing space with the narrow opening and deep depth.SOLUTION: There is provided a cleaning method of a processing chamber in a supercritical processing device in which a support part supporting a substrate is stored in a processing space of the processing chamber, and the substrate is processed in the processing space by processing fluid in a supercritical state. The cleaning method of the processing chamber according to the present invention includes the steps of: making a flat plate-like container storing cleaning liquid supported by a support part and storing the support part in the processing space; filling the processing space with processing fluid in a supercritical state; and discharging the processing fluid.SELECTED DRAWING: Figure 5
【課題】開口が狭く奥行きの深い処理空間を有する超臨界処理チャンバでもその内部を効果的に洗浄することのできる技術を提供する。【解決手段】この発明は、基板を支持した支持部を処理チャンバの処理空間に収容し、処理空間内で基板を超臨界状態の処理流体により処理する超臨界処理装置における、処理チャンバの洗浄方法である。本発明に係る処理チャンバの洗浄方法は、洗浄液を貯留した平皿状の容器を支持部により支持させ、支持部を処理空間に収容する工程と、処理空間を超臨界状態の処理流体で満たす工程と、処理流体を排出する工程とを備える。【選択図】図５ |
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