SUBSTRATE PROCESSING DEVICE AND SUBSTRATE PROCESSING METHOD

To prevent liquid from re-adhering to a substrate when the liquid is removed from the substrate by the processing fluid.SOLUTION: A substrate processing device performs processing by making processing fluid flow onto an upper surface of the substrate supported by a support tray. The support tray inc...

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Bibliographische Detailangaben
Hauptverfasser: ANDO YUKITSUGU, MOTONO TOMOHIRO, SUZUKI KEI, SUMI CHIKATAKE
Format: Patent
Sprache:eng ; jpn
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Beschreibung
Zusammenfassung:To prevent liquid from re-adhering to a substrate when the liquid is removed from the substrate by the processing fluid.SOLUTION: A substrate processing device performs processing by making processing fluid flow onto an upper surface of the substrate supported by a support tray. The support tray includes: a tray member which has a substrate-opposing surface opposing to a lower surface of the substrate; and multiple support members which are attached to the tray member so as to surround the substrate-opposing surface, and supports the substrate in such a state that the substrate is separated upwards from the substrate-opposing surface by the support member. The tray member includes: a downstream side erected portion which is erected on the upper side with respect to the substrate-opposing surface while being located close to the peripheral surface on the downstream side of the substrate supported by the multiple support members; a groove which is provided in the downstream side adjacent region adjacent to the downstream side erected portion in the outer peripheral region of the substrate-opposing surface and collects liquid that has entered the downstream side adjacent region from the gap between the substrate and the downstream side erected portion; and a discharge part which connects the inside of the groove with the internal space and discharges the liquid collected by the groove into the internal space.SELECTED DRAWING: Figure 2B 【課題】処理流体によって基板から液体を除去した際に、当該液体が基板に再付着するのを防止する。【解決手段】基板処理装置は、支持トレイで支持された基板の上面に処理流体を流して処理する。支持トレイは、基板の下面と対向する基板対向面を有するトレイ部材と、基板対向面を取り囲むようにトレイ部材に取り付けられた複数の支持部材とを有し、支持部材により基板対向面から基板を上方に離間させた状態で基板を支持する。トレイ部材は、複数の支持部材により支持された基板の下流側の周面に近接しながら基板対向面よりも上方に立設された下流側立設部位と、基板対向面の外周領域のうち下流側立設部位に隣接する下流側隣接領域に設けられ、基板と下流側立設部位との隙間から下流側隣接領域に侵入してきた液体を捕集する溝と、溝の内部と内部空間とを連通し、溝により捕集された液体を内部空間に排出する排出部と、を有している。【選択図】図2B