MANUFACTURING METHOD FOR STRUCTURE AND MANUFACTURING METHOD FOR ELECTRONIC COMPONENT DEVICE

To provide a manufacturing method for a structure with excellent adhesion between a resin member and a metal film disposed on the surface thereof and a manufacturing method for an electronic component device including the structure.SOLUTION: The manufacturing method for a structure with a resin memb...

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Bibliographische Detailangaben
Hauptverfasser:	JIANG SHING, NEGORO SHUHEI, USUI KOJI, SHIRAKAMI MASASHI, KAMIMURA KAZUYA
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	To provide a manufacturing method for a structure with excellent adhesion between a resin member and a metal film disposed on the surface thereof and a manufacturing method for an electronic component device including the structure.SOLUTION: The manufacturing method for a structure with a resin member and a metal film disposed on the surface thereof includes selecting the resin member on the basis of the water absorption rate of the resin member.SELECTED DRAWING: Figure 1 【課題】樹脂部材とその表面に配置される金属膜との密着性に優れる構造体及びこの構造体を含む電子部品装置の製造方法。【解決手段】樹脂部材と、前記樹脂部材の表面に配置された金属膜と、を備える構造体の製造方法であって、前記樹脂部材の吸水率に基づいて前記樹脂部材を選択することを備える、構造体の製造方法。【選択図】図１