PROCESSING METHOD

To provide a method capable of fine processing on a workpiece.SOLUTION: A workpiece W to be processed is prepared (S100), and a metal thin film 10 is formed on a surface of the workpiece W as preprocessing (S110). The workpiece W formed with the metal thin film 10 is irradiated with a pulse laser be...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	YAMAUCHI KAORU, MIMURA HIDEKAZU, ANZAI TETSUHISA, MOTOYAMA HIROTO, IWASAKI JUNJI
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	To provide a method capable of fine processing on a workpiece.SOLUTION: A workpiece W to be processed is prepared (S100), and a metal thin film 10 is formed on a surface of the workpiece W as preprocessing (S110). The workpiece W formed with the metal thin film 10 is irradiated with a pulse laser beam 20 from a side of the metal thin film 10 (S120), and processing is performed on the workpiece W (S130). Then, the metal thin film 10 is removed as post processing (S140).SELECTED DRAWING: Figure 1 【課題】ワークを微細加工することが可能な方法を提供する。【解決手段】加工対象のワークＷを準備し（Ｓ１００）、前処理としてその表面に金属薄膜１０を形成する（Ｓ１１０）。続いて、金属薄膜１０が形成されたワークＷに、金属薄膜１０側からパルスレーザー光２０を照射し（Ｓ１２０）、ワークＷを加工する（Ｓ１３０）。そして後処理として、金属薄膜１０を除去する（Ｓ１４０）。【選択図】図１