PLATING DEVICE AND PLATING METHOD

To make an electric field uniform upon plating a substrate having a variety of seed thicknesses and/or patterns to make the plating film thickness distribution uniform.SOLUTION: There is provided a plating device comprising: a plating tank for holding a plating solution; an anode disposed in the pla...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	KIKUCHI TAKEOMI
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	APPARATUS THEREFOR CHEMISTRY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES METALLURGY PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
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