PLATING DEVICE AND PLATING METHOD
To make an electric field uniform upon plating a substrate having a variety of seed thicknesses and/or patterns to make the plating film thickness distribution uniform.SOLUTION: There is provided a plating device comprising: a plating tank for holding a plating solution; an anode disposed in the pla...
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| Format: | Patent |
| Sprache: | eng ; jpn |
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| Zusammenfassung: | To make an electric field uniform upon plating a substrate having a variety of seed thicknesses and/or patterns to make the plating film thickness distribution uniform.SOLUTION: There is provided a plating device comprising: a plating tank for holding a plating solution; an anode disposed in the plating tank; a substrate holder disposed opposite to the anode to hold the substrate; and a resistor disposed between the anode and the substrate, and having a conductive container and an electrolytic solution held in the container.SELECTED DRAWING: Figure 4
【課題】様々なシード厚及び／又はパターンを持つ基板をめっきする際の電場の均一化を図り、めっき膜厚分布の均一化を図ることを１つの目的とする。【解決手段】めっき液を保持するためのめっき槽と、前記めっき槽内に配置されるアノードと、前記アノードに対向して配置され基板を保持する基板ホルダと、前記アノードと前記基板との間に配置された抵抗体であり、導電性の容器と、前記容器の内部に保持された電解液とを有する抵抗体と、を備えるめっき装置。【選択図】図４ |
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