SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME

To provide a substrate and a method for manufacturing the same that do not increase an area of pad sections located below and above via holes while decreasing a width of the via holes.SOLUTION: A substrate according to the present invention has a first insulating layer IL, a second insulating layer...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	KO CHAN HOON, LEE CHULMIN, KIM SANGHOON, OH INHWAN, BAE SOHYUN, LIM KYOUNGHEE
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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