MULTI-LAYERED ELECTRONIC COMPONENT

To provide multi-layered electronic components.SOLUTION: A multi-layered electronic component according to one embodiment of the present invention includes a body including a dielectric layer and an internal electrode, and an electrode layer disposed on the body and connected to the internal electro...

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Bibliographische Detailangaben
Hauptverfasser: YOON DAE WOO, KIM DA MI, KANG BUM SUK, LEE SOO JIN
Format: Patent
Sprache:eng ; jpn
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Zusammenfassung:To provide multi-layered electronic components.SOLUTION: A multi-layered electronic component according to one embodiment of the present invention includes a body including a dielectric layer and an internal electrode, and an electrode layer disposed on the body and connected to the internal electrode, and the electrode layer includes Cu particles and glass, and oxide containing Cu is disposed at least partially at an interface between the Cu particles and the glass.SELECTED DRAWING: Figure 5 【課題】本発明は、積層型電子部品に関する。【解決手段】本発明の一実施形態による積層型電子部品は、誘電体層及び内部電極を含む本体と、上記本体上に配置され、上記内部電極と連結される電極層と、を含み、上記電極層はCu粒子及びガラスを含み、上記Cu粒子と上記ガラスの界面の少なくとも一部には、Cuを含む酸化物が配置される。【選択図】図5