POWER SUPPLY MODULE

POWER SUPPLY MODULE

To provide power supply modules with improved cooling efficiency.SOLUTION: A power supply module has a drive substrate 20,30 that drives electronic circuits 22,32 comprising a plurality of electronic components 22a,32a with different heat generation capacities, and a cooling plate 50 with which the...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: KAMATA TAKAHIDE, MAEDA TAKUHIRO, YAMASHITA MITSUGI, TAKAYAMA MASAKI
Format: Patent
Sprache:eng ; jpn
Schlagworte:
APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC,OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWERSUPPLY SYSTEMS
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
CONTROL OR REGULATION THEREOF
CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUTPOWER
CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
GENERATION
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:To provide power supply modules with improved cooling efficiency.SOLUTION: A power supply module has a drive substrate 20,30 that drives electronic circuits 22,32 comprising a plurality of electronic components 22a,32a with different heat generation capacities, and a cooling plate 50 with which the plurality of electronic components 22a,32a is in contact and cooling fluid is distributed inside. The cooling plate 50 has a flow path 53 that distributes the cooling fluid from the electronic component 22a, which has a relatively small heat generation rate, to the electronic component 32a, which has a relatively large heat generation rate.SELECTED DRAWING: Figure 5 【課題】冷却効率を高めた電源モジュールを提供する。【解決手段】電源モジュールは、発熱量の異なる複数の電子部品２２ａ，３２ａで構成された電子回路２２，３２を駆動させるドライブ基板２０，３０と、複数の電子部品２２ａ，３２ａが接触し、冷却流体が内部に流通する冷却プレート５０と、を備えている。冷却プレート５０には、発熱量が相対的に小さい電子部品２２ａから発熱量が相対的に大きい電子部品３２ａに向かって冷却流体を流通させる流路５３が形成されている。【選択図】図５