LAMINATE FOR ELECTRONIC CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
To provide a laminate for an electronic circuit board, with which a flexible circuit board low in transmission loss of high frequency electric signals can be manufactured.SOLUTION: There is provided a laminate 10 for an electronic circuit board in which a metal sputtering layer 16 is laminated on on...
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| creator | NISHIKAWA TAKAHIRO |
| description | To provide a laminate for an electronic circuit board, with which a flexible circuit board low in transmission loss of high frequency electric signals can be manufactured.SOLUTION: There is provided a laminate 10 for an electronic circuit board in which a metal sputtering layer 16 is laminated on one or both faces of a base material film 15. The base material film contains, as a main component, syndiotactic polystyrene, is biaxially oriented, and has a melting point of 260-290°C, a glass transition temperature of 230-260°C, a dielectric constant at a frequency of 10 GHz of 2.6 or less, a dielectric tangent of 0.002 or less, and a S21 parameter of a copper microstrip line when the microstrip line is formed on the metal sputtering layer of -5 dB/100 mm or more and 0 or less at 40 GHz.SELECTED DRAWING: Figure 1
【課題】高周波電気信号の伝送損失の小さいフレキシブル回路基板を製造可能な電子回路基板用積層体を提供する。【解決手段】基材フィルム１５の片面または両面に金属スパッタリング層１６が積層された電子回路基板用積層体であって、前記基材フィルムは、シンジオタクチックポリスチレンを主成分とし、二軸配向され、融点が２６０～２９０℃、ガラス転移温度が２３０～２６０℃、周波数１０ＧＨｚにおける比誘電率が２．６以下、誘電正接が０．００２以下であり、前記金属スパッタリング層上に銅のマイクロストリップラインを形成したときのＳ２１パラメータが４０ＧＨｚにおいて－５ｄＢ／１００ｍｍ以上、０以下である電子回路基板用積層体１０。【選択図】図１ |
| format | Patent |
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【課題】高周波電気信号の伝送損失の小さいフレキシブル回路基板を製造可能な電子回路基板用積層体を提供する。【解決手段】基材フィルム１５の片面または両面に金属スパッタリング層１６が積層された電子回路基板用積層体であって、前記基材フィルムは、シンジオタクチックポリスチレンを主成分とし、二軸配向され、融点が２６０～２９０℃、ガラス転移温度が２３０～２６０℃、周波数１０ＧＨｚにおける比誘電率が２．６以下、誘電正接が０．００２以下であり、前記金属スパッタリング層上に銅のマイクロストリップラインを形成したときのＳ２１パラメータが４０ＧＨｚにおいて－５ｄＢ／１００ｍｍ以上、０以下である電子回路基板用積層体１０。【選択図】図１</description><language>eng ; jpn</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; LAYERED PRODUCTS ; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PERFORMING OPERATIONS ; PRINTED CIRCUITS ; TRANSPORTING</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240528&DB=EPODOC&CC=JP&NR=2024072479A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,777,882,25545,76296</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240528&DB=EPODOC&CC=JP&NR=2024072479A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>NISHIKAWA TAKAHIRO</creatorcontrib><title>LAMINATE FOR ELECTRONIC CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF</title><description>To provide a laminate for an electronic circuit board, with which a flexible circuit board low in transmission loss of high frequency electric signals can be manufactured.SOLUTION: There is provided a laminate 10 for an electronic circuit board in which a metal sputtering layer 16 is laminated on one or both faces of a base material film 15. The base material film contains, as a main component, syndiotactic polystyrene, is biaxially oriented, and has a melting point of 260-290°C, a glass transition temperature of 230-260°C, a dielectric constant at a frequency of 10 GHz of 2.6 or less, a dielectric tangent of 0.002 or less, and a S21 parameter of a copper microstrip line when the microstrip line is formed on the metal sputtering layer of -5 dB/100 mm or more and 0 or less at 40 GHz.SELECTED DRAWING: Figure 1
【課題】高周波電気信号の伝送損失の小さいフレキシブル回路基板を製造可能な電子回路基板用積層体を提供する。【解決手段】基材フィルム１５の片面または両面に金属スパッタリング層１６が積層された電子回路基板用積層体であって、前記基材フィルムは、シンジオタクチックポリスチレンを主成分とし、二軸配向され、融点が２６０～２９０℃、ガラス転移温度が２３０～２６０℃、周波数１０ＧＨｚにおける比誘電率が２．６以下、誘電正接が０．００２以下であり、前記金属スパッタリング層上に銅のマイクロストリップラインを形成したときのＳ２１パラメータが４０ＧＨｚにおいて－５ｄＢ／１００ｍｍ以上、０以下である電子回路基板用積層体１０。【選択図】図１</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>LAYERED PRODUCTS</subject><subject>LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PERFORMING OPERATIONS</subject><subject>PRINTED CIRCUITS</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNyrEKwjAQANAuDqL-w-EulFgojuflYiJNIsdlLkXiJFqo_4-LH-D0lrdu3IAxJFQGlwV4YFLJKRBQECpB4ZxRLGCyEDEVh6RFQrpAZPXZgnoWzm7brB7Tc6m7n5tm71jJH-r8HusyT_f6qp_xejOt6dredP0Jj3-lL_pkLLU</recordid><startdate>20240528</startdate><enddate>20240528</enddate><creator>NISHIKAWA TAKAHIRO</creator><scope>EVB</scope></search><sort><creationdate>20240528</creationdate><title>LAMINATE FOR ELECTRONIC CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF</title><author>NISHIKAWA TAKAHIRO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2024072479A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; jpn</language><creationdate>2024</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>LAYERED PRODUCTS</topic><topic>LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PERFORMING OPERATIONS</topic><topic>PRINTED CIRCUITS</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>NISHIKAWA TAKAHIRO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>NISHIKAWA TAKAHIRO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>LAMINATE FOR ELECTRONIC CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF</title><date>2024-05-28</date><risdate>2024</risdate><abstract>To provide a laminate for an electronic circuit board, with which a flexible circuit board low in transmission loss of high frequency electric signals can be manufactured.SOLUTION: There is provided a laminate 10 for an electronic circuit board in which a metal sputtering layer 16 is laminated on one or both faces of a base material film 15. The base material film contains, as a main component, syndiotactic polystyrene, is biaxially oriented, and has a melting point of 260-290°C, a glass transition temperature of 230-260°C, a dielectric constant at a frequency of 10 GHz of 2.6 or less, a dielectric tangent of 0.002 or less, and a S21 parameter of a copper microstrip line when the microstrip line is formed on the metal sputtering layer of -5 dB/100 mm or more and 0 or less at 40 GHz.SELECTED DRAWING: Figure 1
【課題】高周波電気信号の伝送損失の小さいフレキシブル回路基板を製造可能な電子回路基板用積層体を提供する。【解決手段】基材フィルム１５の片面または両面に金属スパッタリング層１６が積層された電子回路基板用積層体であって、前記基材フィルムは、シンジオタクチックポリスチレンを主成分とし、二軸配向され、融点が２６０～２９０℃、ガラス転移温度が２３０～２６０℃、周波数１０ＧＨｚにおける比誘電率が２．６以下、誘電正接が０．００２以下であり、前記金属スパッタリング層上に銅のマイクロストリップラインを形成したときのＳ２１パラメータが４０ＧＨｚにおいて－５ｄＢ／１００ｍｍ以上、０以下である電子回路基板用積層体１０。【選択図】図１</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PERFORMING OPERATIONS PRINTED CIRCUITS TRANSPORTING |
| title | LAMINATE FOR ELECTRONIC CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF |
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