LAMINATE FOR ELECTRONIC CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

To provide a laminate for an electronic circuit board, with which a flexible circuit board low in transmission loss of high frequency electric signals can be manufactured.SOLUTION: There is provided a laminate 10 for an electronic circuit board in which a metal sputtering layer 16 is laminated on on...

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1. Verfasser: NISHIKAWA TAKAHIRO
Format: Patent
Sprache:eng ; jpn
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Zusammenfassung:To provide a laminate for an electronic circuit board, with which a flexible circuit board low in transmission loss of high frequency electric signals can be manufactured.SOLUTION: There is provided a laminate 10 for an electronic circuit board in which a metal sputtering layer 16 is laminated on one or both faces of a base material film 15. The base material film contains, as a main component, syndiotactic polystyrene, is biaxially oriented, and has a melting point of 260-290°C, a glass transition temperature of 230-260°C, a dielectric constant at a frequency of 10 GHz of 2.6 or less, a dielectric tangent of 0.002 or less, and a S21 parameter of a copper microstrip line when the microstrip line is formed on the metal sputtering layer of -5 dB/100 mm or more and 0 or less at 40 GHz.SELECTED DRAWING: Figure 1 【課題】高周波電気信号の伝送損失の小さいフレキシブル回路基板を製造可能な電子回路基板用積層体を提供する。【解決手段】基材フィルム15の片面または両面に金属スパッタリング層16が積層された電子回路基板用積層体であって、前記基材フィルムは、シンジオタクチックポリスチレンを主成分とし、二軸配向され、融点が260~290℃、ガラス転移温度が230~260℃、周波数10GHzにおける比誘電率が2.6以下、誘電正接が0.002以下であり、前記金属スパッタリング層上に銅のマイクロストリップラインを形成したときのS21パラメータが40GHzにおいて-5dB/100mm以上、0以下である電子回路基板用積層体10。【選択図】図1