MULTILAYER POLYIMIDE FILM, AND METHOD FOR PRODUCING THE SAME

To provide a multilayer polyimide film with superior physical properties such as transparency, electric characteristics (low linear expansion coefficient, low dielectric constant, low dielectric loss tangent and low transmission loss), heat resistance, and adhesion.SOLUTION: A multilayer polyimide f...

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Bibliographische Detailangaben
1. Verfasser:	FUJIOKA OSAMU
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING
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Beschreibung
Zusammenfassung:	To provide a multilayer polyimide film with superior physical properties such as transparency, electric characteristics (low linear expansion coefficient, low dielectric constant, low dielectric loss tangent and low transmission loss), heat resistance, and adhesion.SOLUTION: A multilayer polyimide film comprises a polyimide layer consisting of three layers: a top layer, a middle layer, and a bottom layer, each of the top layer and the bottom layer comprising heat-treated heat-meltable tetrafluoroethylene polymers, with a total light transmittance of 90% or more and a yellowness (YI) of less than 5.0.SELECTED DRAWING: None 【課題】透明性、電気特性（低線膨張係数、低誘電率、低誘電正接及び低伝送損失）、耐熱性、接着性等の物性に優れる、多層ポリイミドフィルムを提供する。【解決手段】上層、中層、下層からなる３層のポリイミド層を有し、前記上層及び前記下層のそれぞれが、熱処理された熱溶融性のテトラフルオロエチレン系ポリマーを含む、全光線透過率が９０％以上かつ黄色度（ＹＩ）が５．０未満である、多層ポリイミドフィルム。【選択図】なし