WIRING STRUCTURE OF ELECTRONIC COMPONENT AND CONNECTION METHOD OF ELECTRONIC COMPONENT

To reduce transmission loss in large-capacity, high-speed transmission systems, and furthermore, to improve the heat dissipation of a substrate.SOLUTION: In a wiring structure of electronic components, a flexible wiring element 4 having conductive wiring portions formed on the surface of a heat transfer portion 68 provided above an active element 311 and on the surface of a protrusion protruding in a different direction from the height direction on the side surface below the active element 311 among the surfaces of a first electronic component including the active element 311 installed on the substrate and electrically connected to the substrate, is arranged apart from the substrate, and the wiring portion in the flexible wiring element 4 is thermally connected to the first electronic component on the surface of the heat transfer portion 68 and electrically connected on the surface of the protrusion.SELECTED DRAWING: Figure 5 【課題】高速大容量の高速伝送システムにおいて伝送損失の低減を図り、さらに基板の放熱性の向上を図る。【解決手段】電子部品の配線構造は、基板上に設置され当該基板と電気的に接続される能動素子３１１を含む第１電子部品の表面上のうち、能動素子３１１よりも上方に設けられた伝熱部６８の表面上と、能動素子３１１よりも下方において側面に有する高さ方向とは異なる方向に突出した突出部の表面上とに、導電性の配線部が形成された柔軟性を有する柔軟配線体４を、基板から離間して配置させ、柔軟配線体４における配線部は、第１電子部品と、伝熱部６８の表面上において熱的に接続され、突出部の表面上において電気的に接続されることを特徴とする。【選択図】図５