WIRING STRUCTURE OF ELECTRONIC COMPONENT AND CONNECTION METHOD OF ELECTRONIC COMPONENT

To reduce transmission loss in large-capacity, high-speed transmission systems, and furthermore, to improve the heat dissipation of a substrate.SOLUTION: A wiring structure 1 of electronic components is characterized in that a flexible wiring element 4 with conductive wiring portions is arranged on the surface of a first electronic component 31, which is installed on a substrate 2, separated from the substrate 2, and the wiring portion in the flexible wiring element 4 is electrically connected to the first electronic component 31. The wiring structure 1 of the electronic components has a second electronic component arranged over the first electronic component 31 via the flexible wiring element 4, and the wiring portion in the flexible wiring element 4 is electrically connected to the second electronic component. A plurality of the flexible wiring elements 4 are stacked, and the wiring portion in each flexible wiring element 4 is electrically connected to one first electronic component 31.SELECTED DRAWING: Figure 1 【課題】高速大容量の高速伝送システムにおいて伝送損失の低減を図り、さらに基板の放熱性の向上を図る。【解決手段】電子部品の配線構造１は、基板２上に設置される第１電子部品３１の表面上に、導電性の配線部が形成された柔軟性を有する柔軟配線体４を、基板２から離間して配置させ、柔軟配線体４における配線部は、第１電子部品３１と電気的に接続されることを特徴とする。電子部品の配線構造１は、第１電子部品３１の上に、柔軟配線体４を介して第２電子部品を配置させ、柔軟配線体４における配線部は、第２電子部品と電気的に接続される。柔軟配線体４は、複数枚に亘り積層され、各柔軟配線体４における配線部は、一の第１電子部品３１と電気的に接続されている。【選択図】図１