PHOTOSENSITIVE RESIN COMPOSITION AND CURED PRODUCT THEREOF

To provide a photosensitive resin composition which is excellent in resolution and adhesion to a substrate and reduces dew condensation that occurs inside a package when the temperature rapidly changes.SOLUTION: The photosensitive resin composition contains a cationically curable resin (A), a photocationic polymerization initiator (B), and a quencher (C). The cationically curable resin (A) contains 60 mass% or more of a polyfunctional epoxy resin (a-1) having a softening point of 50°C or higher and/or an acid-modified product (a-2) of a polyfunctional epoxy resin having a softening point of 50°C or higher. The quencher (C) contains a compound represented by the following formula (1) (where R1-R3 each independently represent an alkyl group or a phenyl group).SELECTED DRAWING: None 【課題】解像性及び基板への密着性に優れ、急激な温度変化時にパッケージ内部で発生する結露が低減された感光性樹脂組成物を提供すること。【解決手段】カチオン硬化性樹脂（Ａ）、光カチオン重合開始剤（Ｂ）、及びクエンチャー（Ｃ）を含有する感光性樹脂組成物であって、カチオン硬化性樹脂（Ａ）が、軟化点５０℃以上の多官能エポキシ樹脂（ａ－１）及び／又は軟化点５０℃以上の多官能エポキシ樹脂の酸変性物（ａ－２）を６０質量％以上含有し、クエンチャー（Ｃ）が下記式（１）TIFF2024065359000007.tif2241（式中Ｒ１乃至Ｒ３は、それぞれ独立にアルキル基又はフェニル基を示す）で表される化合物を含有する感光性樹脂組成物。【選択図】なし