MULTILAYER STRUCTURE AND RELATED MANUFACTURING METHOD FOR HOSTING ELECTRONIC DEVICE

To alleviate at least one or more of the disadvantages associated with existing solutions of integrated multilayer structures and electronic devices embedded therein.SOLUTION: An integrated multilayer structure (100) includes a first substrate film (102) having a first side (102A) and including an electrically substantially insulating material, preferably moldable and optionally thermoplastic, a plastic layer (112) molded onto and at least partially overlying the first side surface of the first substrate film, and a circuit (104, 106) that optionally includes an electronic component, an electromechanical component, and/or an electro-optical component, and is provided on the second side surface of the first substrate film and functionally connected to the first side surface of the first substrate film.SELECTED DRAWING: Figure 1 【課題】一体型の多層構造体及びそこに埋め込まれる電子機器の、既存の解決策と関連付けられる欠点のうち１又は複数を少なくとも軽減する。【解決手段】一体型の多層構造体（１００）は、第１側面（１０２Ａ）を有し、電気的に実質的に絶縁性の材料を含み、好ましくは成形可能、所望により熱可塑性である第１基板フィルム（１０２）と、第１基板フィルムの第１側の面上に、少なくとも部分的にそれを覆うように成形されるプラスチック層（１１２）と、所望により電子部品、電気機械部品及び／又は電気光学部品を含み、第１基板フィルムの第２側の面に設けられ、第１基板フィルムの第１側の面に機能的に接続される回路（１０４、１０６）と、を含む。【選択図】図１