WAFER PROCESSING METHOD, SYSTEM, AND DEVICE

To provide a wafer processing method, system and device for processing notches in a wafer to prevent the wafer from being damaged during a back-grinding process.SOLUTION: The wafer processing method includes the steps of: preparing a wafer with a notch formed on one side; aligning the wafer by analy...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	LEE KI HEON, KIM KI HO, HAN JUNG YUL, PARK JI HUN, JUNG IL JUN
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TRANSPORTING
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