WAFER PROCESSING METHOD, SYSTEM, AND DEVICE

To provide a wafer processing method, system and device for processing notches in a wafer to prevent the wafer from being damaged during a back-grinding process.SOLUTION: The wafer processing method includes the steps of: preparing a wafer with a notch formed on one side; aligning the wafer by analy...

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Bibliographische Detailangaben
Hauptverfasser:	LEE KI HEON, KIM KI HO, HAN JUNG YUL, PARK JI HUN, JUNG IL JUN
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TRANSPORTING
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Beschreibung
Zusammenfassung:	To provide a wafer processing method, system and device for processing notches in a wafer to prevent the wafer from being damaged during a back-grinding process.SOLUTION: The wafer processing method includes the steps of: preparing a wafer with a notch formed on one side; aligning the wafer by analyzing video information of the notch taken by a vision camera; and machining the notch using a notch wheel so that a certain area of the notch has a predetermined thickness.SELECTED DRAWING: Figure 3 【課題】ウェハの切り欠きを加工してバックグラインディング工程中にウェハが破損されることを防止するウェハ加工方法、システム及び装置を提供する【解決手段】ウェハ加工方法は、一側に切り欠き部が形成されたウェハを準備するステップと、ビジョンカメラで撮影した前記切り欠き部の映像情報を分析して前記ウェハを整列させるステップと、切り欠きホイールを用いて前記切り欠き部の一定領域が予め設定された厚さを有するように前記切り欠き部を加工するステップと、を含む。【選択図】図３