MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

To suppress variations in semiconductor device characteristics.SOLUTION: A horizontal line 500A that makes up the crosshair displayed on a monitor of a wire bonding device is overlayed with a first line segment LS1 of a first landmark MK1, and a bonding region BR is specified by overlapping the vert...

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Bibliographische Detailangaben
1. Verfasser:	TAKAISHI RYUSEI
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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Beschreibung
Zusammenfassung:	To suppress variations in semiconductor device characteristics.SOLUTION: A horizontal line 500A that makes up the crosshair displayed on a monitor of a wire bonding device is overlayed with a first line segment LS1 of a first landmark MK1, and a bonding region BR is specified by overlapping the vertical line 500B forming the crosshair with a first line segment LS2 of a second mark MK2.SELECTED DRAWING: Figure 8 【課題】半導体装置の特性変動を抑制する。【解決手段】ワイヤボンディング装置のモニタに表示される十字線を構成する横線５００Ａを第１目印ＭＫ１の第１線分ＬＳ１と重ね合わせ、且つ、十字線を構成する縦線５００Ｂを第２目印ＭＫ２の第１線分ＬＳ２と重ね合わせることで、ボンディング領域ＢＲを特定する。【選択図】図８