GRINDING METHOD FOR WORK-PIECE

To provide a grinding method for a work-piece that can reduce variation in quality of the work-piece.SOLUTION: A grinding method for a work-piece, which grinds a work-piece with a grinding wheel including a grinding stone, includes: a first holding step of holding a dressing board with a holding sur...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	TANEMURA DAISUKE, SUZUKI KEIICHI
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TRANSPORTING
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Beschreibung
Zusammenfassung:	To provide a grinding method for a work-piece that can reduce variation in quality of the work-piece.SOLUTION: A grinding method for a work-piece, which grinds a work-piece with a grinding wheel including a grinding stone, includes: a first holding step of holding a dressing board with a holding surface of a first chuck table; a dressing step of grinding the dressing board with a grinding surface side of the grinding stone to form an end part at the grinding surface side of the grinding stone into a curve shape; a second holding step of holding the work-piece with a holding surface of a second chuck table; and a grinding step of grinding the work-piece with the grinding surface side of the grinding stone to form a concave part in the work-piece.SELECTED DRAWING: Figure 4 【課題】被加工物の品質のばらつきを低減することが可能な被加工物の研削方法を提供する。【解決手段】研削砥石を含む研削ホイールで被加工物を研削する被加工物の研削方法であって、第１チャックテーブルの保持面でドレッシングボードを保持する第１保持ステップと、研削砥石の研削面側でドレッシングボードを研削して研削砥石の研削面側の端部を曲面状に整形するドレッシングステップと、第２チャックテーブルの保持面で被加工物を保持する第２保持ステップと、研削砥石の研削面側で被加工物を研削して被加工物に凹部を形成する研削ステップと、を含む。【選択図】図４