ACOUSTIC WAVE DEVICE AND MANUFACTURING METHOD OF ACOUSTIC WAVE DEVICE

To rationally prepare a structure that facilitates dissipation of heat of a device chip constituting an acoustic wave device to the outside without complicating the structure and without complicating the manufacturing processes.SOLUTION: An acoustic wave device 1 includes a device chip 3 having a fu...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	KANEKO HIROOMI
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	BASIC ELECTRONIC CIRCUITRY ELECTRICITY IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS RESONATORS
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!