SUBSTRATES FOR SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
To provide a substrate for a semiconductor device in which the structure of each part of the resulting semiconductor device can be optimized by providing regulating portions at appropriate locations.SOLUTION: In a substrate for a semiconductor device in which at least a metal portion serving as an e...
Gespeichert in:
Hauptverfasser: | , |
---|---|
Format: | Patent |
Sprache: | eng ; jpn |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Zusammenfassung: | To provide a substrate for a semiconductor device in which the structure of each part of the resulting semiconductor device can be optimized by providing regulating portions at appropriate locations.SOLUTION: In a substrate for a semiconductor device in which at least a metal portion serving as an electrode portion is formed on a mother substrate, a mounting area for a semiconductor element and a regulating part for regulating the semiconductor element are provided on the mother board. The height dimension of the regulating portion is set to be equal to or less than the thickness dimension of the semiconductor element mounted in the semiconductor element mounting area.SELECTED DRAWING: Figure 14
【課題】適切な箇所に規制部を設け、得られる半導体装置各部の構造を最適化できる、半導体装置用基板を提供する。【解決手段】母型基板上に少なくとも電極部となる金属部が形成される半導体装置用基板である。母型基板上には、半導体素子の搭載領域と、半導体素子を規制する規制部が設けられている。規制部の高さ寸法は、半導体素子の搭載領域に搭載される半導体素子の厚さ寸法以下に設定されている。【選択図】図14 |
---|