SEMICONDUCTOR MODULE

To provide a semiconductor module securing reliability of a solder for chip junction while saving space of a chip mounting area in the semiconductor module having a power semiconductor chip.SOLUTION: In a region where an end of a circuit wiring pattern 20 and a semiconductor chip 23 are close, the c...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	ASHIDA YOSHIAKI, SASAKI KOJI
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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