VAPOR DEPOSITION MASK GROUP, METHOD FOR MANUFACTURING ELECTRONIC DEVICE, AND ELECTRONIC DEVICE

To provide a vapor deposition mask group without reducing a light transmittance even when increasing the area of a negative electrode.SOLUTION: A vapor deposition mask group may include; a first vapor deposition mask having a plurality of first open holes including an area arranged a first direction...

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Bibliographische Detailangaben
Hauptverfasser:	HIGUCHI TAKUYA, OCHIAI HIROMITSU, OKA HIROKI
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	To provide a vapor deposition mask group without reducing a light transmittance even when increasing the area of a negative electrode.SOLUTION: A vapor deposition mask group may include; a first vapor deposition mask having a plurality of first open holes including an area arranged a first direction D1 and a second direction D2 intersecting the first direction; and a second vapor deposition mask having a plurality of second open holes 25B arranged in the first and second directions. When superimposing the second vapor deposition mask on the first vapor deposition mask, the first open hole may partially overlap with the second open hole.SELECTED DRAWING: Figure 16 【課題】陰極の面積を大きくしても光の透過率が低下しない蒸着マスク群を提供する。【解決手段】蒸着マスク群は、第１方向及び第１方向Ｄ１に交差する第２方向Ｄ２に沿って配列されている領域を含む複数の第１貫通孔を有する第１蒸着マスクと、第１方向及び第２方向に沿って配列されている複数の第２貫通孔２５Ｂを有する第２蒸着マスクと、を備えてもよい。第１蒸着マスクと第２蒸着マスクとを重ね合わせた場合、第１貫通孔と第２貫通孔とが部分的に重なってもよい。【選択図】図１６