POLYAMIDE COMPOSITION AND MOLDED ARTICLE

To provide a polyamide composition which enables formation of a molded article that has a low relative dielectric constant, and has good mechanical rigidity and excellent strength, moldability and surface appearance while satisfactorily maintaining impact resistance, and a molded article obtained by molding the polyamide composition.SOLUTION: A polyamide composition contains (A) aliphatic polyamide, (B) semi-aromatic polyamide containing a dicarboxylic acid unit and a diamine unit, (C) an amorphous resin (excluding polyamide) having a glass transition temperature obtained when the temperature thereof is raised by 20°C/min of 80°C or higher and 250°C or lower, in differential scanning calorimetry according to JIS-K7121, (D) a polymer containing an α,β-unsaturated dicarboxylic anhydride as a constitutional unit, and (E) at least one kind of a glass filler, wherein the content of (B) the semi-aromatic polyamide, the content of (C) the amorphous resin, and a relative dielectric constant at a frequency of 1 GHz of (E) the glass filler are within respective predetermined ranges.SELECTED DRAWING: None 【課題】低比誘電率を有し、耐衝撃性を良好に保ちながら、良好な機械的剛性及び強度、成形性及び表面外観性に優れた成形品を形成可能なポリアミド組成物及び前記ポリアミド組成物を成形してなる成形品を提供する。【解決手段】ポリアミド組成物は、（Ａ）脂肪族ポリアミドと、（Ｂ）ジカルボン酸単位とジアミン単位とを含有する半芳香族ポリアミドと、（Ｃ）ＪＩＳ－Ｋ７１２１に準じた示差走査熱量測定において、２０℃／ｍｉｎで昇温したときに得られるガラス転移温度が８０℃以上２５０℃以下の非晶性樹脂（但し、ポリアミドを除く）と、（Ｄ）α，β不飽和ジカルボン酸無水物を構成単位に含む重合体と、（Ｅ）少なくとも１種のガラス充填剤を含有し、前記（Ｂ）半芳香族ポリアミドの含有量、前記（Ｃ）非晶性樹脂の含有量、及び前記（Ｅ）ガラス充填材の周波数１ＧＨｚにおける比誘電率が、所定範囲内である。【選択図】なし