INSPECTION DEVICE AND STAMP INSPECTION DEVICE USING THE SAME
To provide an inspection device capable of accurately inspecting whether or not a chip component is adhered to the predetermined place of a stamp, with a compact device configuration, even when the chip component is small and to provide a stamp inspection device using the inspection device.SOLUTION:...
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| Format: | Patent |
| Sprache: | eng ; jpn |
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| Zusammenfassung: | To provide an inspection device capable of accurately inspecting whether or not a chip component is adhered to the predetermined place of a stamp, with a compact device configuration, even when the chip component is small and to provide a stamp inspection device using the inspection device.SOLUTION: The inspection device includes a photographing unit which includes a light source for irradiating the surface of an inspection object with light and a line scan camera for imaging the surface of the inspection object and moving means which moves at least one of the inspection object and the photographing unit in a direction crossing the scan direction of the line scan camera on the surface of the inspection object and acquires the two-dimensional image of the surface of the inspection object, to inspect the surface state.SELECTED DRAWING: Figure 4
【課題】 スタンプの所定箇所にチップ部品が付着しているか否かの検査を、コンパクトな装置構成で、チップ部品が小さくても正確に行うことを可能とする検査装置およびこれを用いたスタンプ検査装置を提供すること。【解決手段】 検査対象表面に光を照射する光源と、前記検査対象表面を撮像するラインスキャンカメラを有した撮影ユニットと、前記検査対象表面における前記ラインスキャンカメラのスキャン方向に対して交差する方向に、前記検査対象と前記撮影ユニットの少なくとも一方を移動させる移動手段とを備え、前記検査対象表面の２次元画像を取得して前記表面状態を検査する。【選択図】 図４ |
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