POLISHING APPARATUS AND POLISHING METHOD

To reduce an amount of slurry deposited on an outer peripheral part of a holding surface.SOLUTION: A polishing apparatus for polishing a workpiece comprises: a disc-like chuck table which has a circular holding surface that holds the workpiece; a polishing unit which is provided on the upper side with respect to the chuck table, has a columnar spindle in which a longitudinal part is arranged along a height direction of the chuck table, and in which a polishing tool including a polishing pad for polishing the workpiece is attached to a lower end of the spindle; a slurry supply unit which has a slurry supply path for supplying slurry to the polishing pad when polishing the workpiece with the polishing pad; and a fluid supply unit which has a supply port that is arranged on the outer side with respect to an outer peripheral edge of the holding surface in a radial direction of the holding surface and supplies fluid to an outer peripheral part of the chuck table, and a supply path that is connected to the supply port.SELECTED DRAWING: Figure 1 【課題】保持面の外周部に堆積するスラリーの量を低減する。【解決手段】被加工物を研磨するための研磨装置であって、被加工物を保持する円形の保持面を有する円盤状のチャックテーブルと、チャックテーブルよりも上方に設けられ長手部がチャックテーブルの高さ方向に沿って配置された円柱状のスピンドルを有し、スピンドルの下端部に被加工物を研磨する研磨パッドを含む研磨工具が装着される研磨ユニットと、研磨パッドで被加工物を研磨する際に研磨パッドにスラリーを供給するスラリー供給路を有するスラリー供給ユニットと、保持面の径方向において保持面の外周縁よりも外側に配置され且つチャックテーブルの外周部に流体を供給する供給口と、供給口に接続された供給路と、を有する流体供給ユニットと、を備える研磨装置を提供する。【選択図】図１