VACUUM BONDING DEVICE

To provide a vacuum bonding device capable of making the properties of the adhesive uniform.SOLUTION: A vacuum bonding device 1 includes: a vacuum chamber 5 capable of accommodating a lower member (lower board K2) and an upper member (upper board K1) in a vacuum environment; a lower table 4 on which the lower member is placed in the vacuum chamber; an upper table 3 that holds the upper member in the vacuum chamber; a table temperature control mechanism 60 that adjusts the temperature of either or both of the lower table and the upper table for each arbitrarily set area; a vertical movement mechanism (pin vertical movement mechanism 80) that moves the upper table in the vertical direction; and a vacuum pump mechanism P0 that executes vacuuming to discharge the gas inside the vacuum chamber to the outside.SELECTED DRAWING: Figure 2 【課題】接着剤の特性を均一にする。【解決手段】真空貼合装置１は、下部材（下基板Ｋ２）と上部材（上基板Ｋ１）とを真空環境下で収納可能な真空チャンバ５と、真空チャンバ内で下部材を載置する下テーブル４と、真空チャンバ内で上部材を保持する上テーブル３と、任意に設定されたエリア毎に下テーブル及び上テーブルのいずれか一方又は双方の温度を調節するテーブル温度調節機構６０と、上テーブルを上下方向に移動させる上下動機構（ピン上下動機構８０）と、真空チャンバの内部の気体を外部に排出する真空引きを実行する真空ポンプ機構Ｐ０と、を有する。【選択図】図２