ELECTROSTATIC CHUCK DEVICE

To provide an electrostatic chuck device that suppresses the occurrence of cracks in a ceramic layer due to a difference in thermal expansion between a substrate and a sleeve due to heat generated when the ceramic layer is formed.SOLUTION: An electrostatic chuck device 1 includes a substrate 10, a l...

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Hauptverfasser: HAGIWARA TOMOYA, TOCHIHIRA JUN
Format: Patent
Sprache:eng ; jpn
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Beschreibung
Zusammenfassung:To provide an electrostatic chuck device that suppresses the occurrence of cracks in a ceramic layer due to a difference in thermal expansion between a substrate and a sleeve due to heat generated when the ceramic layer is formed.SOLUTION: An electrostatic chuck device 1 includes a substrate 10, a laminate 2 including at least an internal electrode 20 laminated on the substrate 10, and a ceramic layer 50 laminated on the upper surface of the laminate 2 in the thickness direction, and the substrate 10 has a through hole 60 provided so as to penetrate in the thickness direction, a sleeve 70 made of an insulating material is inserted into the through hole 60, and the sleeve 70 is joined to the through hole 60 via joining means 80 at the upper portion of the substrate 10 in the thickness direction.SELECTED DRAWING: Figure 1 【課題】セラミックス層を形成する際に発生する熱による基板とスリーブの熱膨張の差に起因して、セラミックス層に亀裂が生じることを抑制した静電チャック装置を提供する。【解決手段】基板10と、基板10上に積層された内部電極20を少なくとも含む積層体2と、積層体2の厚さ方向の上面に積層されたセラミックス層50と、を備え、基板10は、厚さ方向に貫通して設けられた貫通穴60を有し、貫通穴60に絶縁性材料からなるスリーブ70が挿入され、スリーブ70が基板10の厚さ方向の上部にて、接合手段80を介して貫通穴60に接合された静電チャック装置1。【選択図】図1