DISMANTLABLE ADHESIVE COMPOSITION, AND PRODUCTION METHOD OF THE SAME

To provide a dismantlable adhesive composition capable of dismantling an adhesion bonded part by an external impact of a comparatively low temperature, and a production method of the same.SOLUTION: A dismantlable adhesive composition includes: an organic adhesive constituent (A); a compound (B) of a...

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Bibliographische Detailangaben
Hauptverfasser:	AZUMA HIDEKO, SHUDO HIROSHI, KATO KATSUMI, OTA MINAMI
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY DYES METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	To provide a dismantlable adhesive composition capable of dismantling an adhesion bonded part by an external impact of a comparatively low temperature, and a production method of the same.SOLUTION: A dismantlable adhesive composition includes: an organic adhesive constituent (A); a compound (B) of an inorganic onium ion with a negative ion selected from the group consisting of a halogen ion, a perhalogen acid ion, and an inorganic acid ion; and a water-soluble polymer (C).SELECTED DRAWING: None 【課題】比較的低温な外的刺激により接着接合部を解体可能な解体性接着剤組成物及びその製造方法を提供すること。【解決手段】（Ａ）有機系接着剤成分、（Ｂ）無機オニウムイオンと、ハロゲンイオン、過ハロゲン酸イオン及び無機酸イオンからなる群から選択される陰イオンとの化合物、並びに（Ｃ）水溶性ポリマーを含む、解体性接着剤組成物。【選択図】なし