HEAT CONDUCTIVE MEMBER AND METHOD FOR MANUFACTURING HEAT CONDUCTIVE MEMBER

To provide a heat conductive member and a method for manufacturing the heat conductive member with improved thermal conductivity.SOLUTION: A heat conductive member 2A includes a graphite sheet 20, a metal layer 30, a sintered layer 40, and a circuit board 10. The metal layer 30 is provided on at lea...

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Hauptverfasser:	ONISHI NORIAKI, YAMAJI NORIO
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	To provide a heat conductive member and a method for manufacturing the heat conductive member with improved thermal conductivity.SOLUTION: A heat conductive member 2A includes a graphite sheet 20, a metal layer 30, a sintered layer 40, and a circuit board 10. The metal layer 30 is provided on at least one surface of the graphite sheet 20. The sintered layer 40 is adjacent to the metal layer 30 and has a plurality of metal particles sintered therein. The circuit board 10 is for mounting a semiconductor element 3. The sintered layer 40 then joins the circuit board 10 and the metal layer 30.SELECTED DRAWING: Figure 2 【課題】熱伝導性がより高められた熱伝導部材および熱伝導部材の製造方法を提供する。【解決手段】熱伝導部材２Ａは、グラファイトシート２０と、金属層３０と、焼結層４０と、回路基板１０と、を備える。金属層３０は、グラファイトシート２０の少なくとも一方の面に設けられている。焼結層４０は、金属層３０と隣接し、複数の金属粒子を焼結させている。回路基板１０は、半導体素子３を実装するためのものである。そして、焼結層４０は、回路基板１０と金属層３０を接合する。【選択図】図２