CONDUCTIVE COMPOSITION, CURED PRODUCT OF THE SAME, AND MANUFACTURING METHOD OF ELECTRONIC COMPONENT USING THE CONDUCTIVE COMPOSITION

To provide a conductive composition that can suppress microcracks of a conductor circuit, which is generated when a substrate where a conductive layer (conductor circuit) is formed by using a conductive composition is three-dimensionally molded, and can easily discriminate presence/absence of cracks...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	OBUCHI KENTARO, OZAWA SATSUKI, ARAI YASUAKI, SEINO KYO, YAMAFUJI SEIYA, SHIMAMIYA MARIKO, SATO KAZUYA
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	To provide a conductive composition that can suppress microcracks of a conductor circuit, which is generated when a substrate where a conductive layer (conductor circuit) is formed by using a conductive composition is three-dimensionally molded, and can easily discriminate presence/absence of cracks by visual observation.MEANS: A conductive composition contains at least an epoxy resin, a thermoplastic resin and a conductive filler, wherein the thermoplastic resin has a glass transition temperature of 80°C or higher.SELECTED DRAWING: None 【課題】導電性組成物を用いて導電層（導体回路）を形成した基板を立体成型した際に発生する、導体回路のマイクロクラックを抑制することができるとともに、目視により容易にクラック有無の判別が可能な導電性組成物を提供する。【手段】エポキシ樹脂と、熱可塑性樹脂と、導電性フィラーとを少なくとも含んでなる導電性組成物であって、前記熱可塑性樹脂は、ガラス転移温度が８０℃以上であることを特徴とする、導電性組成物とする。【選択図】なし