GLASS SUBSTRATE, MULTILAYER WIRING BOARD, AND METHOD FOR MANUFACTURING GLASS SUBSTRATE

To provide a glass substrate where it is possible to form a penetrating electrode having good adhesion.SOLUTION: A glass substrate has a first surface and a second surface, and includes at least one through hole penetrating from the first surface to the second surface. A dispersion roughness of a si...

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Bibliographische Detailangaben
1. Verfasser:	SAWADAISHI MASASHI
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREOUSENAMELS CHEMISTRY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY GLASS JOINING GLASS TO GLASS OR OTHER MATERIALS METALLURGY MINERAL OR SLAG WOOL SEMICONDUCTOR DEVICES SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS,MINERALS OR SLAGS SURFACE TREATMENT OF GLASS
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Beschreibung
Zusammenfassung:	To provide a glass substrate where it is possible to form a penetrating electrode having good adhesion.SOLUTION: A glass substrate has a first surface and a second surface, and includes at least one through hole penetrating from the first surface to the second surface. A dispersion roughness of a side surface shape in a cut surface of the through hole in a thickness direction of the glass substrate is 1500 nm or more, and an unevenness width is 1500 nm or more.SELECTED DRAWING: Figure 1 【課題】本発明では、良好な密着性を備えた貫通電極を形成することが可能なガラス基板を提供することを目的とする。【解決手段】本発明の一実施形態によると、第一面と第二面を有し、前記第一面から前記第二面まで貫通する少なくとも１つの貫通孔を備えるガラス基板であって、前記ガラス基板の厚さ方向における貫通孔の裁断面における側面形状の分散粗さが１，５００ｎｍ以上、かつ凹凸巾が１，５００ｎｍ以上であることを特徴とする。【選択図】図１