ELECTRONIC COMPONENT

To provide an electronic component that suppresses a thermal influence on a circuit board.SOLUTION: A resistor 10 is so constituted that a resistive element 7 formed in a center part region 6 on a first surface of an insulation substrate 2, internal electrodes 8a to 8d formed in end regions 9a, 9b o...

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Bibliographische Detailangaben
Hauptverfasser: MIYASHITA KYOHEI, AOKI HIROTOSHI, YAMASHITA YOSHIFUMI
Format: Patent
Sprache:eng ; jpn
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Beschreibung
Zusammenfassung:To provide an electronic component that suppresses a thermal influence on a circuit board.SOLUTION: A resistor 10 is so constituted that a resistive element 7 formed in a center part region 6 on a first surface of an insulation substrate 2, internal electrodes 8a to 8d formed in end regions 9a, 9b opposed across the center region 6, etc., are covered with an exterior member 5, and a second surface of the insulation substrate 2 is exposed from a top surface part of the exterior member 5 to come into tight contact with an external metal member 14. Further, protrusion parts 5a, 5b separating the resistor 10 from a circuit board 12 are formed at a place including a portion of a lower surface part of the exterior member 5 which corresponds to lead-out parts of lead terminals 3a to 3d in a thickness direction of the exterior member.SELECTED DRAWING: Figure 5 【課題】回路基板への熱影響を抑制する電子部品を提供する。【解決手段】抵抗器10は絶縁基板2の第1の表面の中央部領域6に形成された抵抗体7、中央部領域6を挟んで対向する端部領域9a,9bに形成された内部電極8a~8d等が外装部材5で覆われ、外装部材5の上面部において絶縁基板2の第2の表面が外部の金属部材14へ密着可能に露出した構成を有する。また、外装部材5の下面部のうちリード端子3a~3dの導出部分と外装部材の厚さ方向において対応する部位を含む箇所に、抵抗器10を回路基板12から離間する突出部5a,5bが形成されている。【選択図】図5