POLISHING COMPOSITION AND MANUFACTURING METHOD FOR MAGNETIC DISK SUBSTRATE

To provide a polishing composition used for polishing Ni-P substrates capable of reducing scratches while maintaining practical workability.SOLUTION: A polishing composition used for polishing a Ni-P substrate is provided. This polishing composition contains colloidal silica, an acid, a defect reduc...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	OYAMA TAKAHARU, TAKAMIZU YOSUKE
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	ADHESIVES CHEMISTRY DRESSING OR CONDITIONING OF ABRADING SURFACES DYES FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING INFORMATION STORAGE INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORDCARRIER AND TRANSDUCER MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS PAINTS PERFORMING OPERATIONS PHYSICS POLISHES POLISHING TRANSPORTING
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Beschreibung
Zusammenfassung:	To provide a polishing composition used for polishing Ni-P substrates capable of reducing scratches while maintaining practical workability.SOLUTION: A polishing composition used for polishing a Ni-P substrate is provided. This polishing composition contains colloidal silica, an acid, a defect reducing agent, and water. As the defect reducing agent, a heterocyclic aromatic chemical compound having an amino group is used.SELECTED DRAWING: None 【課題】Ｎｉ－Ｐ基板の研磨に用いられて、実用的な加工性を維持しながら、スクラッチを低減し得る研磨用組成物を提供する。【解決手段】Ｎｉ－Ｐ基板の研磨に用いられる研磨用組成物が提供される。この研磨用組成物は、コロイダルシリカと、酸と、欠陥低減剤と、水とを含む。上記欠陥低減剤としては、アミノ基を有する複素環芳香族化合物が用いられる。【選択図】なし