SUBSTRATE PROCESSING METHOD, SUBSTRATE PROCESSING APPARATUS, AND COMPUTER STORAGE MEDIUM

To suppress defects during exposure processing due to unevenness on the back surface of a substrate.SOLUTION: A substrate processing method that performs a series of processes to form a resist pattern on a substrate includes the steps of forming a flattening film for flattening the back surface of t...

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1. Verfasser:	SUGANO ITARU
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR BASIC ELECTRIC ELEMENTS CINEMATOGRAPHY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MATERIALS THEREFOR ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	To suppress defects during exposure processing due to unevenness on the back surface of a substrate.SOLUTION: A substrate processing method that performs a series of processes to form a resist pattern on a substrate includes the steps of forming a flattening film for flattening the back surface of the substrate before the exposure treatment performed together with the series of treatments, and removing the flattening film after the exposure treatment.SELECTED DRAWING: Figure 8 【課題】基板の裏面の凹凸に起因する露光処理時の不良を抑制する。【解決手段】基板に対してレジストパターンを形成するための一連の処理を行う基板処理方法であって、前記一連の処理と共に行われる露光処理前に、前記基板の裏面を平坦化させるための平坦化膜を形成する工程と、前記露光処理後に、前記平坦化膜を除去する工程と、を含む。【選択図】図８