SUBSTRATE PROCESSING APPARATUS

To effectively prevent the adhesion of contaminants and pattern collapse, which tend to occur in the center of a substrate in a substrate processing technology that processes a substrate with processing fluid in a processing space of a processing container.SOLUTION: A substrate processing apparatus includes, in an upper discharge flow path that discharges a processing fluid that has passed above and below the substrate individually, and discharges the processing fluid that has passed above the substrate, an upstream portion that communicates with a processing space above the substrate, a buffer space that communicates with the upstream portion and has a larger cross-sectional area of the flow path than the upstream portion, a downstream portion that connects a pair of openings provided at both ends of the buffer space and a fluid discharge portion, and a rectifying portion that is provided at the connection between the upstream portion and the buffer space and makes the pressure loss in the center lower than the pressure loss at both ends.SELECTED DRAWING: Figure 3 【課題】処理容器の処理空間で基板を処理流体によって処理する基板処理技術において、基板の中央部で生じやすい汚染物の付着やパターン倒壊を効果的に防止する。【解決手段】本発明に係る基板処理装置は、基板の上方および下方を通過した処理流体をそれぞれ個別に排出し、基板の上方を通過した処理流体を排出する上側排出流路には、基板よりも上方で処理空間に連通する上流部と、上流部に連通し上流部よりも流路断面積が大きいバッファ空間と、バッファ空間の両端部にそれぞれ設けられた１対の開口と流体排出部とを接続する下流部と、上流部とバッファ空間との接続部に設けられ、中央部の圧力損失を両端部における圧力損失よりも低くする整流部とを備えている。【選択図】図３